Fully Bottom-Up Waste-Free Growth of Ultrathin Silicon Wafer via Self-Releasing Seed Layer

Author

J.-E. Hong, Y. Lee, S.-I. Mo, H.-S. Jeong, J.-H. An, H.-E. Song, J. Oh, J. Bang, J.-H. Oh*, K.-H. Kim*

Co-author

Advanced Materials 2103708 (2021)

Year

2021

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Highlighted on Back Cover

Link

https://doi.org/10.1002/adma.202103708 787회 연결