목록 관리 검색 Characterization of Atomic-Layer-Deposited (ALD) Al2O3-Passivated Sub-50-μm-thick Kerf-less Si Wafers by Controlled Spalling Author Y. H. Lee, H. Cha, S. Choi, H. S. Chang, B. jang, J. Oh* Co-author Electronic Materials Letters 14(3), 363-369 (2018) Year 2018 Link https://link.springer.com/article/10.1007/s13391-018-0039-9 375회 연결 Electronic Materials Letters 14(3), 363-369 (2018)
