A tungsten interlayer process for fabrication of through-pore AAO scaffolds on gold substrates

Author

J. Oh, Y.C. Shin, and C.V. Thompson*

Co-author

Journal of the Electrochemical Society 158, K11 (2011).

Year

2011

Link

https://iopscience.iop.org/article/10.1149/1.3514606/meta 342회 연결